SIMETRY SmartSIM+ Technical Overview and eSIM Architecture

eSIM Technology Overview

An eSIM (Embedded Subscriber Identity Module) is a programmable SIM chip built directly into a device’s hardware or integrated onto its circuit board. Unlike traditional removable SIM cards, eSIMs enable over-the-air provisioning of mobile network profiles without the need for physical handling.

Remote SIM Provisioning (RSP) is the standard method used to manage eSIMs. RSP enables a carrier profile to be securely downloaded, activated, and managed remotely via:

• QR codes

• Mobile device management (MDM) platforms

• Carrier or enterprise provisioning systems

After a profile is installed, the eSIM connects to the mobile network just like a traditional SIM. Many eSIMs can store multiple profiles, though only one is active at a time.

For organizations developing custom hardware, solderable eSIM chips can be embedded into circuit boards. These chips support standard GSMA-compliant RSP workflows and function similarly to eSIMs in commercial devices.

SIMETRY SmartSIM+ Overview

SIMETRY’s SmartSIM+ is a physical SIM card built using eSIM (eUICC) technology. These tri-cut cards support Mini-SIM (2FF), Micro-SIM (3FF), and Nano-SIM (4FF) form factors and are fully compatible with eUICC remote provisioning standards.

These cards:

• Support dynamic provisioning and remote carrier profile management

• Eliminate the need to replace SIMs when switching carriers

• Enable global and multi-carrier connectivity via remote updates

Provisioning is handled via the same GSMA-compliant RSP mechanisms noted earlier. SIMETRY manages profile assignments, lifecycle transitions, and failover configurations across supported devices.

Additional eSIM Deployment Options

In addition to physical SmartSIM+ cards, SIMETRY offers two other eSIM deployment methods:

• Direct eSIM profile provisioning: Push profiles directly to compatible end-user devices without using a physical SIM card. This requires devices to support an LPA (Local Profile Assistant) or QR-based activation.

• Direct-from-carrier eSIM provisioning: Activate eSIM profiles from major U.S. carriers on supported hardware using LPA codes, QR codes, or remote triggers.

These options are ideal for enterprise, fleet, and IoT deployments requiring flexible carrier selection and minimal physical intervention.

Technical & Electrical Specifications: SIMETRY SmartSIM+ (Tri-Cut)

Form Factor:

• Tri-cut: 2FF (Mini-SIM), 3FF (Micro-SIM), 4FF (Nano-SIM)

Material (Typical):

• PVC or PET depending on model

• PET recommended for higher durability and heat resistance

Product Grade:

• Plug 85: -25°C to +85°C, 5-year lifespan

• Plug 105: -40°C to +105°C, 10-year lifespan

• Quad: -40°C to +105°C, 17-year lifespan

• All grades support 2G/3G/LTE; Industrial/Automotive also support high humidity, corrosion resistance, and eXtended-Life OS

Compliance Standards:

• ISO 7810: Physical characteristics

• ISO 7816-1: Electrical characteristics

• ISO 7816-2: Contact locations

• ISO 7816-3: Transmission protocols

• ISO/IEC 10373-1: Test methods

• ETSI TS 102.221, ETSI TS 102.671, AEC Q100 (Automotive)

Operating Temperature Range:

• -25°C to +85°C (Standard)

• -40°C to +105°C (Industrial/Automotive)

Storage Temperature Range:

• -40°C to +85°C

Insertion Durability:

• Up to 500,000 insertions

Voltage Compatibility:

• 1.8V / 3V / 5V (multi-voltage support)

Communication Protocols:

• T=0 and/or T=1 (standard smart card protocols)

Security Domains & OS:

• JavaCard / GlobalPlatform OS

• ECASD, ISD-R, ISD-P (security architecture)

• Support for GSMA SGP.22 / SGP.32 profile delivery and management

Special Features:

• eUICC enabled (multi-profile, reprogrammable)

• Multi-IMSI support (based on SIMETRY configuration)

• OTA profile switching & fallback configuration support.

For further implementation guidance, profile provisioning workflows, or model-specific certifications (e.g., carrier whitelisting or PTCRB approvals), please contact your SIMETRY account representative.